Halogen-containing polymers have been used in lithography for a long time, for example, fluorine-containing polymers have been used in photoresists. With the use of shorter exposure light wavelengths for photolithography, aromatic structures cannot be used as a plasma etch mask in a photoresist due to their strong absorbance. Fluorine-containing polymers have been developed because of their etch resistance and transparence. The etch properties of halogenated polymers are not exactly like the polymers that contain only C, H, and O. In his 1983 paper [3], Ohnishi found halogencontaining polymers were not following the trend in certain etch gases. From the literature, we can see that people had modified the Ohnishi parameter to fit their etch rates of fluorine-containing polymers in different ways. However, the modifications are more mathematical, and there is no theory that can explain the physical meaning. Here, we selectedthree published papers and analyzed their data and conclusions based on our polymer decomposition theory.
Halogen-containing polymers have been used in lithography for a long time, for example, fluorine-containing polymers have been used in photoresists. With the use of shorter exposure light wavelengths for photolithography, aromatic structures cannot be used as a plasma etch mask in a photoresist due to their strong absorbance. Fluorine-containing polymers have been developed because of their etch resistance and transparence. The etch properties of halogenated polymers are not exactly like the polymers that contain only C, H, and O. In his 1983 paper [3], Ohnishi found halogencontaining polymers were not following the trend in certain etch gases. From the literature, we can see that people had modified the Ohnishi parameter to fit their etch rates of fluorine-containing polymers in different ways. However, the modifications are more mathematical, and there is no theory that can explain the physical meaning. Here, we selected<br>3發表的論文,並基於我們的聚合物分解理論,分析他們的數據和結論。
正在翻譯中..
