As the BD does not match to POD, I will ask customer for clarification.
For 凹 lead design, I am not sure it is dimple or top side half etch.
As this device already produced in other subcon, even we want to propose other design to customer, we also need to address reason to let customer design.
Please advise whether we are unable to do this design or we can do this design but need other special control/ tooling / design in place.